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Rework

  • High Volume, Quick Turn BGA, PBGA, CBGA, CSP, LGA
  • Rework & Inspection
  • BGA, CCGA, CBGA, and Micro BGA Component Reballing
  • Customized Component and Board Reflow Process Development
  • Component underfill
  • Mandatory baking and dry air enviroment
  • Complete automation for repeatability
  • IR monitoring of the temperature profile
  • PCB and traces repair